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AQ1
4. Heat sink (for AQ10A2-ZT4/32VDC)
27 ± 2
CAD Data
2-M3 Screw
5.2
.205
External dimensions
58 ± 2
2.283 ± .079
13.8
.543
1.063 ± .079
47.6
1.874
2.5
.098
40
1.575
9
.354
30 ± 2
1.181 ± .079
2-M3 Screw depth: min. 10mm
Knurl surface
8 8 8 8 8 8 8
.315.315.315.315.315.315.315
Heat sink attached to AQ1 relay
General tolerance: ± 0.5 ± .020
Note: When using heat sink, please refer to “Thermal Design”
5. DC output, 1A and 2A types (Vertical)
Copper foil
CAD Data
External dimensions
33
1.299
10
.394
1
Mounting hole location
(Copper-side view)
25.4
1.000
2 3 4
4-1.2 dia.
4-.047 dia.
2.54 × 3
.100 × 3
2.54 × 5
.100 × 5
2.54 × 2
.100 × 2
OUTPUT
INPUT
25
.984
6
.236
1
2
3 4
1
.039
Schematic
7.62 12.7
.300 .500
5.08
.200
SSR
LOAD
1 2
INPUT
3 4
(25.4)
(1.000)
+ –
+ –
4-0.8 dia.
4-.031 dia.
NOTE
1. When using bent output terminals
To avoid applying mechanical stress on
the main unit and molded section of the
solid state relay, radio pliers should be
used to grasp the terminals between the
point of bending and the molded case
when making the bends.
Solid state relay
Terminal bend section
Printed circuit board
Solder
5.3
.209
General tolerance: ± 0.5 ± .020
2. Thermal design
When a heat sink is mounted on the
10 A type
The heat sink (AQ-HS-5A) or a radiator
which can make good contact should be
used.
If a heat sink is used in which the contact
condition is bad, a heat conducting
compound should be used to improve the
heat radiation. (Ex. Silicon compound
Toshiba silicon YG6111 or TSK5303) The
compound should be applied between
the heat sink and the AQ1.
AQ-HS-5A heat sink
AQ10A2-ZT4/32VDC
Printed circuit board
4-M3 screws
(provided with AQ-HS-5A)
Approx. 0.6N·m of torque should be
used for tightening the M3 screws.
Load
Load Input
power source power source
Tolerance: ± 0.1 ± .004
ASCTB24E 201201-T1
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
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